Alpha CVP-520 is a low-temperature solder paste, lead-free, no cleaning, and halogen-free. Designed to implement low-temperature surface mount assembly technology. The melting point of lead-free alloys is below 140 ° C, and Alpha CVP-520 low-temperature solder paste has been successfully used for peak reflow curves between 155 ° C and 190 ° C.

The tin bismuth silver alloy selected by Alpha CVP-520 ensures a lower melting point during melting and re solidification processes, excellent resistance to thermal cycling cracking, colorless and transparent flux residue, and higher electrical resistivity than industry standards.