Alpha OM338PT is a lead-free, non cleaning solder paste with SAC305 composition of Sn96.5Ag3.0Cu0.5. It is suitable for various applications and is also one of the commonly used solder pastes in lead-free process technology.

Alpha OM338PT exhibits excellent printing capability on different designed plates, especially under the conditions of repeatable printing with ultra-fine spacing (11mil square) and high yield applications. The excellent reflow process window of OM338PT enables it to complete welding on CuOSP plates well, with good fusion with various sizes of solder joints. Its excellent performance includes preventing the formation of irregular solder beads.